Solving Weak-Micro Vias: High Connection Reliability Electroless Copper Plating Solution
Achieving thin film deposition of non-electrolytic copper plating! It greatly contributes to the formation of fine circuits on semiconductor package substrates and the improvement of via connection reliability!
In recent years, with the miniaturization and high performance of electronic devices, semiconductor devices have also become more refined and functional. There is a growing demand for further miniaturization of wiring and reduction of via diameters in semiconductor package substrates that connect semiconductor devices to the main substrate. Okuno Pharmaceutical Industry has newly developed products to meet the demands for fine wiring. Highest via connection reliability: Electroless copper plating solution: OPC FLET Copper - Achieves crystal continuity at the bottom of the via - Conventional baths see a significant increase in resistance due to a decrease in the thickness of the electroless copper plating film OPC FLET Copper shows good conductivity even at low film thickness - Controls the plating deposition rate - The deposition rate becomes gradual over time, suppressing deposition on copper - Conventional baths tend to have excessive surface film thickness OPC FLET Copper achieves sufficient coverage at low film thickness - Excellent connection reliability for small-diameter vias
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
